Superconducting
IQM + VTT: 300 qubits, 2027, Finland
IQM and VTT confirmed that a 300-qubit IQM Radiance system will be deployed and operated in Finland in 2027, with an initial 150-qubit stage delivered by end-2026 and the full machine folded into Finland's national supercomputing infrastructure; the parties say it will be the largest superconducting quantum computer built in Europe[15].
Technical implication: going 150 to 300 in two steps is an engineering cadence that cuts the risk in half rather than a single leap. Public information gives no two-qubit gate fidelity (the fraction of operations performed correctly when two qubits are operated together), coherence time, or full-chip median data, so this "largest" is for now a claim about scale alone.
Against current public benchmarks: the error-correction yardstick on the superconducting path remains Google Willow's 105 physical qubits with a surface-code error-suppression factor Λ≈2.1 (each step up in code distance drops the logical error rate to roughly 1/2.1), while IBM Nighthawk pairs 120 physical qubits with 218 tunable couplers. On qubit count alone, 300 clears both — but qubit count has never been a metric that earns credit on its own: IBM Condor's 1,121 qubits dropped out of the main line long ago because its fidelity was not competitive. What is still missing: until full-chip median fidelity and TLS fluctuation data (material defects that let coherence times drift across a 2–3× range) are published, there is no way to judge how deep a circuit this machine can run.
Landscape impact: European high-performance computing buyers gain a domestic alternative, putting direct pressure on IBM's and Rigetti's machine-time sales in Europe. The first verifiable numbers will have to wait for the 150-qubit stage at the end of 2026.
Photonics
ASML puts its name into quantum hardware: a lithography partnership with Xanadu
Xanadu and ASML announced a collaboration to develop advanced lithography processes for Xanadu's photonic quantum hardware, aiming to reduce optical loss in quantum chips and to explore better patterning control through lithography[19].
Technical implication: every fidelity figure on the photonic path is a conditional value given "photon detected"; the real hard constraint is the end-to-end loss budget. Moving the loss problem from bench-top tuning into lithography process parameters is the only scalable fix this path has. Against current public benchmarks, PsiQuantum's Omega — 99.22%±0.12% two-qubit fusion fidelity and 99.72% chip-to-chip interconnect fidelity (over 42 meters of fiber) on GlobalFoundries' 300mm line — remains the best published result on the photonic path; this collaboration has yet to produce any device data. What is still missing: an itemized loss budget — without one, no fusion fidelity number can be compared across systems.
Landscape impact: manufacturing dependence on the photonic path extends from foundries to lithography equipment makers, further concentrating supply-chain leverage. From process exploration to tape-out validation, the timescale is measured in years.
Repeaters and Quantum Networks
Diamond repeater node: roughly 10× photon collection efficiency, 78% teleportation fidelity
Following recent related coverage, the increment here is a complete single-node operation running end to end: a system integrating diamond color centers (atomic defects in the diamond lattice) used a "repeat-until-success" emission protocol to raise photon collection efficiency to roughly 10× that of prior single-shot excitation methods, and completed a full set of single-node operations including heralded transfer and quantum teleportation at 78% fidelity. The source says this validates the approach's potential for future quantum networks[10].
Technical implication: long-distance entanglement has been bottlenecked on photon collection efficiency, with single-shot excitation success rates low enough to make the payoff predictably poor. Only with an order-of-magnitude efficiency gain does stringing nodes into a link become a real conversation. But 78% is still far from link quality usable directly for error correction, and it is not the same measurement as the photonic path's 99.72% chip-to-chip interconnect over 42 meters of fiber — the two cannot be compared directly.
Landscape impact: roadmaps for metro-scale entanglement distribution and quantum repeater vendors remain at the prototype stage; from single node to two-node link, the timescale is measured in years.
Spin Quantum Dots
NVision selected for the EuroHPC Quantum Grand Challenge NVision was selected for the EuroHPC Quantum Grand Challenge program with its spin-qubit approach[33]. Against current public benchmarks: the spin path already matches the best fidelity results (99.99% for donor qubits, and devices randomly sampled from 300mm production wafers exceeding 99%), but device scale remains around 12 qubits, and the number of operations executable per unit coherence time is the lowest tier among the five mainstream paths. What is still missing: uniformity when scaling from a dozen qubits to hundreds, plus the cryogenic wiring density to match.
Quobly and Absolut System sign an industrial partnership declaration The two signed an industrial partnership declaration to support the development and production scale-up of Quobly's spin-qubit quantum computer, with cryogenic infrastructure as the focal point[34]. Business implication: the spin qubit's biggest selling point is that it can use off-the-shelf silicon production lines, but refrigeration and wiring remain external dependencies — whoever standardizes that piece first will be the first to bend their system cost curve down. Declarations of this kind are statements of intent; execution pace depends on what follows.
Materials and Devices
Substrates: strontium titanate layer thickness reaches 100× prior levels La Luce Cristallina's QP-STOI wafers, evaluated by the U.S. National Institute of Standards and Technology (NIST), carry a strontium titanate (STO) layer 100× thicker than prior levels, targeting quantum and cryogenic devices[16]. Technical implication: substrate availability directly determines device yield and iteration speed. The original text gives no dielectric or loss figures, so this is supply-side progress rather than a performance record. Landscape impact: midstream suppliers to cryogenic electronics and quantum devices gain one more procurable specification.